Siemens Simcenter Flotherm XT 2310 | 4.4 Gb
The Mentor, a Siemens business, is pleased to announce the availability of Simcenter Flotherm XT 2310 - CAD Centric electronics cooling software and sister product to Simcenter Flotherm. For thermal designers, working in Simcenter Flotherm XT’s CAD-centric interface, there are a variety of enhancements to help with PCB thermal modeling. What's new in Simcenter Flotherm XT 2310 Model the complexity Realize localized PCB thermal modeling fidelity – Standalone Thermal Territories
Previously, Simcenter Flotherm XT established the value of component localized options for thermal modeling fidelity to provide the advantage of accuracy for modeling copper and layers beneath critical components. This computational efficiency solution remains a good alternative to explicitly modeling a whole board. In PCBs with many components positioned in close proximity or with overlapping thermal influence, there are workflow efficiency and modeling advantages to selecting an area for higher fidelity modeling instead of managing multiple component localized territories
In Simcenter Flotherm XT 2304, you can now designate a thermal territory independent of a specific component and draw it freely with any aspect ratio on a PCB. This allows you to configure your model and select appropriate accuracy more quickly.
Now with Simcenter Flotherm XT’s thermal territories, you can now select to assign a thermal territory to a component or set a thermal territory based on a board location, while assigning an aspect ratio. You can effectively assign enhanced PCB localized thermal modeling anywhere on the board. The table below recaps the thermal territory options you can select based on the fidelity you are pursuing and your design stage information availability.
Navigate multi-layer PCB models easily – New Stackup Editor
It can be time consuming to edit layer properties for multi-layer complex PCBs. A new Board Layer Stackup Editor comes with improves workflow with easier multi-select and edit functionality and updated user experience. The short video below illustrates improvements.
Go faster & explore the possibilities Smart PCB and electrothermal co-simulation updates
When modeling a entire PCB as a network assembly using the Smart PCB in Simcenter Flotherm XT 2304 for computationally efficient solution purposes, you can now gain further insight on joule heating calculations during the solve. You can turn on node calculation updates and show net outlines to speed up the process of setting up the Smart PCB.
During Hyperlynx PI co-simulation for PCB electrothermal modeling, added functionality now supports automatically detecting powered nets and automatic creation of a joule heat global goal. (For an introduction to electrothermal co-simulation, please see this video)
Parametric studies with Smart PCB
The thermal attribute attachment on a network assembly can now be varied in parametric study. The thermal attribute is entered as an input variable for network assembly nodes and different attributes applied for different scenarios.
Stay Integrated Model Interoperability – XTXML export now supports SmartParts
To aid integration and data interchange with other Siemens tools and even within the Simcenter Flotherm family of tools, there are new updates for export of model assemblies leveraging XTXML format export. The XTXML schema has been updated to support SmartParts. One example usage is in exporting geometry to Simcenter Flotherm via the MCAD Bridge Module (see video above). One particular useful application is for exporting clean CAD based package geometry created in Simcenter Flotherm Package Creator for Simcenter Flotherm XT for subsequent use in Simcenter Flotherm 2304.
Multiple heat sources on a die – Excel import ease of use
In response to user feedback, a faster way to build and specify power to multiple heat sources on a single die in an electronics package model has been created in Simcenter Flotherm Package Creator. Users can now directly import from Microsoft Excel, the data to specify position, size and power applied when creating a package.
Transient electronics cooling simulation – Simplified thermostatic control
From modern electronics, e.g smartphones and tablets, to power electronics in electric vehicles – transient thermal modeling has increasingly been adopted to better model in-use scenarios and evaluate power control strategies to go beyond the prediction of critical component temperatures for reliability purposes.
Performing full 3D transient thermal CFD analysis is computationally intensive and simulation time for long studies is often limited during competitive electronics development timescales so providing options to simplify and speed the set up, run, stop and restart of multiple transient analysis cases is very advantageous.
Transient modeling with simple thermostatic control in Simcenter Flotherm XT 2020.1 helps this in 2 related ways:
1. Using goals to stop a transient thermal analysis – Halt on Goal
Goals are possible to set as a temperature of a component, a surface, junction temperature or otherwise. To halt a simulation based on reaching, exceeding a temperature, it is as simple as setting this criteria in the “Solution Control” sheet now
The time the simulation reaches this goal during a simulation run and halted is then reported.
2. Using halt on goal in a parametric study to run multiple transient simulation cases
The ability to halt simulations with a goal enables more efficient scheduling of multiple transient studies as part of a parametric study. More usefully, at Simcenter Flotherm XT 2020.1, this allows you to run cases consecutively using a previously halted simulation end point as the start point for the new simulation with different logic and new halt on goal criteria applied.
Consider a simple case: If you want to run a study with certain simulation control logic applied until a temperature is reached, stop the simulation, and then restart a simulation with different criteria, such as a component power setting or fan control logic option applied that would cool device until a lower temperature is reached, then you can do this easily. Below is an example parametric study tabular set up to illustrate:
The very simple parametric study above is broken down into a base initiation case and then 3 scenarios:
- Power switched off and a fan activated when temperature exceeded
- Power switched back on and fan deactivated when temperature reduced sufficiently- Power switched off and fan activated
Please view a linked blog by Kelly Cordell-Morris – “Simple Thermostatic Control” for a more detailed look at transient modeling using the new halt on goal capabilities in Simcenter Flotherm XT.
EDA data integration – Simcenter Flotherm XT EDA bridge save/load and library enhancements
Simcenter Flotherm XT EDA bridge, for PCB model generation including component layout and trace, now includes the ability to save work during PCB ECAD data import process easily. This uses file extension *.edabridge. Now during a transfer or import the user is prompted if they want to save the current file or create a new file. Also, if a project includes a PCB transferred from EDA Bridge with components from a local library of one user and this is moved to a different user without the components in their library, then, the new user will be prompted to add the components to their own library.
FloTHERM XT is a unique, award-winning thermal simulation solution that can be used during all stages of the electronics design process - from conceptual design to manufacturing - improving product quality, reliability and time-to-market. Based on the electronics cooling DNA of the Mentor market-leading FloTHERM technology and the FloEFD CAD-centric philosophy, the award-winning FloTHERM XT product is the industry’s first integrated mechanical design automation (MDA) and electronic design automation (EDA) electronics cooling solution. The FloTHERM XT product can be used at all stages of the electronic design process, from design concept through manufacturing. Its CAD-centric technology and robust mesher simulates complex geometries with ease, speed, and accuracy for improved product quality and reliability. Simcenter Flotherm XT Mentor Graphics, a Siemens Business, is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronic, semiconductor and systems companies. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products help conquer complex design challenges. Mentor is technology leader in full chip emulation, Functional Verification, Design-for-Test and physical verification with its Veloce, Questa, Tessent and Calibre platforms. Product: Siemens Simcenter FloTHERM XTVersion: 2304Supported Architectures: x64Website Home Page : www.mentor.comLanguage: englishSystem Requirements: PC *Size: 4.4 Gb * System Requirements: Supported Platforms
Supported Operating Systems (Full Software):
- Microsoft Windows 7 Professional, Ultimate or Enterprise 64-bit edition latest SP
- Microsoft Windows 10 Versions 1903 and 1909 (Pro or Enterprise 64-bit edition).
- Microsoft Windows Server 2012R2 64-bit edition (*) .
- Microsoft Windows Server 2016 64-bit edition.
(*) Please note that this will be the last version to support Windows Server 2012 R2.
Hardware and OS Requirements
- x64 compatible PC
- Ethernet network adapter
- Mouse or other pointing device
- 1024 MB RAM minimum, more recommended
- Graphics card with OpenGL support minimum 64 MB memory and minimum XGA screen resolution (1024 x 768)
- Microsoft Office 2003 latest SP; Microsoft Office 2007 latest SP; Microsoft Office 2010 latest SP
- Minimum disk space requirements: 9 GB, which includes space necessary during installation and when modifying an existing installation. Note that 4 GB is always required on the default drive (C:\ or equivalent) whether installing to the default drive or a non-default drive
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