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- 2024-04-18
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ANSYS Inc. has announced the availability of the 2024 edition of its ANSYS Electronics Suite of electronics and electromagnetics simulation software solutions.  ANSYS has announced the release of Ansys Electronics 2024 R1. This solutions help you design innovative electrical and electronic products faster and more cost-effectively than ever before. What's New in Ansys Electronics Desktop 2024 R1Ansys Electronics Desktop (AEDT) provides highly integrated electromagnetic simulators, circuit/system simulation, ECAD links, and compliance reporting. The single desktop allows users to insert and co-simulate among multiple design types. Click to see what's new: Electronics Desktop- New view navigation controls- Open MPI support extended to all relevant products in AEDT- CPython connection to AEDT through gRPC- Shared web licensing support for Pro, Premium, and Enterprise- Animation export to Ensight format- Improved display precision for near-zero floating point values- Dark and light themes (Beta, Windows only)- Ansys Cloud Gateway job management from AEDT (Beta)- Web client for batch solve monitoring and reporting (Beta)3D Modeler- Copy-paste of designs with encrypted components- Discovery 3D Modeler live connection- Granta material attribute import from CAD files- Improvements to subregions- Lightweight geometry import through Discovery- Integrated Hoops translators (Beta)HFSS- Array metadata export- Array mask automation through CSV import- SBR+ Antenna blockage with dielectric objects and VRT- SBR+ PTD/UTD wedge editing improvement- Memory usage improvement for Distributed Matrix Assembly- Automatic prediction of the upper multipaction power threshold- Distributed Sparse Direct Solver: Partial solve without grouping port unknowns- Layout Component in 3D enhancements (Beta)- Flex PCB support for Layout component in 3D (Beta)- Q3D DCR in HFSS 3D (Beta)- Composite subgroup in network analysis (Beta)HFSS 3D Layout- Multizone support for Layout components- Usability and performance enhancements- Rigid Flex workflow enhancements- IC mode enhancements- Encrypted technology support in IC mode- SIwave Near Field simulation in 3D Layout (Beta)- Extensions to EDB CPython API (Beta)- Q3D in 3D Layout IC mode (Beta)- RaptorX in 3D Layout IC mode (Beta)Icepak- AEDT Icepak import into Workbench- PCB workflow enhancements- Cylindrical orthotropic properties- Post-processing and reporting enhancements- Slider bar meshing enhancements- Enhanced expression support- Solar loading per object- Official release of improved mesh regions- ECXML import/export speed enhancements- Thermal Mesh Fusion (Beta)- GPU Computing for Solver (Beta)Maxwell- Litz twisting effects on DC resistance- Magnetostriction enhancements- NVH workflow for inverter-fed electric motors- Nonlinear resistive sheet for 3D magnetostatic solution- Shell element for modeling thin conductors- Support value boundary for magnetostatic DDM solution- Magnetostriction enhancements to initial stress- Improve core loss calculations with Hysteresis Core Loss Model- Enhancements to Maxwell Machine Toolkit with Motor-CAD post processing- Support for Voltage in Maxwell-Fluent co-simulation for Electric Arc application- Python API for custom core loss definition- 2D Motor symmetry meshing enhancements- Support loss adaptive refinement for eddy current solution (Beta)- Layout Component in 3D Enhancements (Beta)- Flex PCB Support for Layout Component in 3D (Beta)- Expression cache calculations with light weight post processor (Beta)AEDT Mechanical- Official release of Transient Thermal- Enabled AEDT Mechanical import into Workbench- Layout component with trace mapping in Thermal and Structural (Beta)- Enhanced Layout component gridcut slider & visualization (Beta)Q3D Extractor- Commercial release of distributed memory solver for CG- Commercial release of transition region solver- Enhanced multi-face uniform current terminals in DC-R- MLFMM for improved AC-RL solver performance Circuit General Enhancements:- Custom terminations- New TDR analysis options- Support for EMI receiver CISPR25- Semiconductor characterization tool- Transient diagnostic tools- Motor model(s) for power electronics- Add terminal names for RLGC PSpice sub-circuit- Enhanced DDR5 support in Nexxim: AMI support for clock-forwarded architectures- Print all top-level node voltages checkbox on transient/dc analysis menu- New MIPI C-PHY transmitter component (Beta)SPISim Enhancements:- Add optimization mechanism and associated GUI settings to CTLE AMI models- Enable RX_CLOCK of IBIS 7.1 for DDR5- Add back-channel interface (BCI) for future TX/RX co-optimization- Batch mode support for IBIS modeling flow and other usage improvementsFilterSolutions- Balanced filter export to AEDTEMIT- Optimal N-to-1 feature and improvements- Maintain and access multiple channel-level results- Enable/disable radios and emitters- Improved STK-EMIT integration/automation- MIPI C-PHY ToolkitTwin Builder- PSPICE performance improvements- Battery Wizard enhancements- HPPC fitting error display in Battery Wizard- Export State Space Model to Modelica Package- Using conservative pins to connect thermal LTI-ROMs- Parametric field history in Static ROM Builder- LS-OPT/LS-DYNA ROM extraction and export- Optimization algorithms for parameter calibration- Improved useability for fusion workflow- TD Composer workflow improvements- PyTwin: Enhance 3D data handling with TBROMGranta- 44 new Materials Data for Simulation (MDS) records:- 10 magnet materials- 1 solder resist material- 16 polymer grades- 17 PCB laminates- Updated record names for Panasonic Megtron 7 and Ventec tec-speed 6.0 Selected Defect Corrections Electronics Desktop- 837334 – Delta marker functionality in Eye plots.- 872310 – AEDT now opens correctly when a polar report with data markers is opened.- 875305 – NDE plot now shows correct data marker values when marker is edited.Circuit- 457738 – Sensi setup with optiSLang inside gives correct results.- 834498 – Capacitor substrate definition no longer crashes circuit UI.- 865255 – Resolved AEDT crash issue with SIwave dynamic linked component.EMIT- 776007 – The scenario matrix and scenario details views are responsive for multi-interferer analysis of many systems.HFSS- 829801 – Field recovery no longer slow for spatial material with tabulated.- 843057 – FilterSolutions port tuning now works correctly for all length unit settings.HFSS 3D Layout- 827914 – Pin group port handling improvements during SIwave HFSS Region simulations initiated from HFSS 3D Layout.Icepak- 604530 – Optimetrics no longer stops randomly for Transient designs with extremely small end times.- 770416 – Optimetrics with Icepak-DCIR coupling with varying current values in Layout works as expected.- 840026 – Varying ambient temperature specification works as expected.Maxwell- 837242 – Resolved Maxwell Transformer current sharing issues (ROM for Simplorer).Mechanical- 841688 – AEDT Mechanical solver now works as expected on AMD-based PCs.Twin Builder- 851034 – Successfully import PSpice models using TABLE references if the dynamic table data can be evaluated as constant - Numerous Useability and Performance EnhancementsANSYS Electromagnetics Suite或ANSYS电子套件是几个用于模拟电磁系统的强大程序的集合。使用此产品，您可以高精度地模拟电磁系统，并研究电气和电磁设备的行为。该程序可用于各种工业分支。ANSYS Electromagnetics Suite适用于一般和特殊行业。例如，在机电设备中，例如电动机，发电机，变流器，继电器，电力电子或磁体设计以及MEMS中，该产品具有特殊功能，在高速芯片或高频微波组件中，例如内置芯片，IC和集成电路，PCB的内部连接，天线，微波组件以及最终的生物机械设备和EMI / EMC药物都有很多应用。在普通模式和通用模式下，该程序具有许多应用程序，例如：研究激励下的性能特征，对设备周围或内部的电磁场进行可视化可视化，热效应和产生的热量，功率分配和调查变形模式，设计中关键参数的研究，例如：扭矩，力，电阻，阻抗，存储，S参数以及辐射和光发射等。该软件包包括用于低频电磁场仿真的三个软件ANSYS Maxwell，用于电磁波三维场仿真的ANSYS HFSS和用于复杂电子电源系统和电气控制系统仿真的ANSYS Simplorer，涵盖了工程师的所有需求。给了。Ansys 电磁场仿真可帮助用户快速、经济地设计出创新性的电子电气产品。当今世界，高性能电子产品以及先进的电气化系统随处可见，因此电磁场对电路和系统的影响不容忽视。Ansys 软件能够对组件、电路和系统设计的电磁性能进行独立仿真，还可以对温度、振动和其他重要机械效应进行评估。这一独特的以电磁为中心的设计流程可帮助进一步实现高级通信系统、高速电子设备、机电设备组件和电力电子系统的首次通过的系统设计。  无线通信与射频 Ansys 高频电磁设计软件支持对天线与射频以及微波组件的性能进行设计、仿真和验证。微波集成电路和系统的建模功能可直接集成到 EM 求解器中，由此构建一个完整的系统验证平台，以对新一代射频和微波设计进行全系统验证。 PCB 与电子封装 Ansys 芯片-封装-系统 (CPS) 设计流程具有极其强大的仿真功能，采用该流程将大幅加快高速电子设备的电源完整性、信号完整性和 EMI 的分析速度。自动化热力分析和集成式结构分析功能在芯片-封装-电路板上提供了业内极为全面的芯片感知和系统感知仿真解决方案。 机电与电力电子 Ansys 机电与电力电子仿真软件非常适用于需要将电机、传感器和作动器与电子控制装置进行强大集成的应用领域。Ansys 软件可对这些组件之间的交互进行仿真，而设计流程则可集成热力和机械分析，以评估冷却策略并分析噪声、振动与声振粗糙度 (NVH) 等关键机械效应。 电子产品热管理 Ansys 电子产品热管理解决方案充分利用了先进的求解器技术和强大的网格自动划分功能，该解决方案将帮助用户快速进行对流和强制空气冷却策略的热交换和流体流动仿真。该解决方案可支持用户进行冷却策略设计，避免因过热导致 IC 封装、印刷电路板 (PCB)、数据中心、电力电子产品和电动机的性能降低。 此集合中包含的软件：ANSYS电子桌面ANSYS EMITANSYS PEmagANSYS PExprtANSYS SavantANSYS SIwaveANSYS Twin Builder ANSYS Electronics Desktop is a comprehensive platform that enables electrical engineers to design and simulate various electrical, electronic and electromagnetic components, devices and systems. It is a unified interface which creates and analyzes electromagnetic (EM), thermal and circuit designs.Engineers can access gold-standard tools such as ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor and ANSYS Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, the Electronics Desktop includes direct links to the full ANSYS portfolio of thermal, fluid and mechanical solvers for comprehensive multiphysics analyses. Engineers can integrate rigorous 2D and 3D physics analyses with system and circuit simulations, all inside a single framework called ANSYS Electronics Desktop. Any combination of products within the Electronics Desktop can be inserted into a single project. For instance, you can combine disparate design types such as HFSS, Circuit and Icepak into a single project. Schematics can be used to wire up different field solver models and create a model of a high-level system through dynamic links that combine 3D EM and SPICE circuit analyses. Engineers can efficiently manage complex projects that require several different analysis tools to predict the operation of their electronic products. Designs can also be parameterized. With Optimetrics, design variations can be studied and made available to other modules when the designs are included in a higher-level simulation. This allows engineers to conduct what-if experiments and study the effects of component design parameter variations on the behavior of the entire system. RF Desense is high on the list of design challenges faced by engineers designing wireless electronic products. Engineers seeking a solution for desense will benefit from using ANSYS HFSS and EMIT to successfully identify and mitigate desense in wireless electronic products. This video gives an overview of the simulation technique used in HFSS and EMIT to solve problems pertaining to radio-frequency interference or RFI, desense, and co-existence. The video also describes the topics of RFI, RF Coexistence and RF Desense.Founded in 1970, ANSYS employs nearly 3,000 professionals, many of whom are expert M.S. and Ph.D.-level engineers in finite element analysis, computational fluid dynamics, electronics, semiconductors, embedded software and design optimization. Our exceptional staff is passionate about pushing the limits of world-class simulation technology so our customers can turn their design concepts into successful, innovative products faster and at lower cost. As a measure of our success in attaining these goals, ANSYS has been recognized as one of the world's most innovative companies by prestigious publications such as Bloomberg Businessweek and FORTUNE magazines. Owner: ANSYS
Product Name: Electronics
Version: Suite 2024 R1
Supported Architectures: x64
Website Home Page : www.ansys.com
Languages Supported: english
System Requirements: Windows & Linux **
Size: 44.6 Gb
* release info:ELECTRONICS_2024R1_WINX64-SSQ
ELECTRONICS_LOCAL_HELP_2024R1-SSQ
MCAD_TRANSLATORS_2024R1_WINX64-SSQ
ELECTRONICS_2024R1_LINX64-SSQ
ELECTRONICS_LOCAL_HELP_2024R1_LINX64-SSQ * System Requirements: Platform Support Defining the optimum computer infrastructure for use of Ansys software begins with understanding the computing platforms that are tested and supported by Ansys. Download the link below to learn about the computing platforms we support as well as reference system architectures recommended by valued partners. The PDF files below provide platform support information for the current Ansys release, including certification and test information for operating systems, graphics cards, job schedules and other platform components. 所需系统 Windows 7/8/8 / 8.1 / 10推荐的最低配置（为实现最佳性能）：
支持的处理器：AMD Athlon 64，AMD Opteron，具有Intel EM64T支持的Intel Xeon，具有Intel EM64T支持的
Intel Pentium 4
视频卡：128位SVGA或PCI Express视频卡
硬盘空间4.5 GB
内存：8 GB
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