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- 2025-12-17
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Siemens Simcenter FloEFD 2412 for Siemens NX (x64) | 1 GB Siemens Digital Industries Software announces the new release of its Simcenter FLOEFD software for Siemens NX, a CAD-embedded computational fluid dynamics (CFD) tool. New Features
The new Simcenter FLOEFD 2512 software release as of December 12, 2025 is now available in all its CAD-embedded CFD variants, and also the Simcenter 3D embedded variant. This release delivers focused improvements for fast sealing of geometry for internal flow analyses for all general purpose CFD applications through to multiple enhancements for electronics thermal analysis workflows. Please read on below to explore every new feature grouped under key Simcenter pillars, or scan the topic list on the left hand side to shortcut to the sections that interest you most.
Go Faster
Auto-sealing of CAD geometry for internal flow CFD analysis
There are many reasons for performing internal flow CFD simulations depending on modeling application or computational efficiency. For any internal flow scenario, you want to seal geometry as quickly and efficiently as possible
For complex CAD assemblies with hundreds or thousands of parts, this can become a time consuming challenge to make the geometry watertight. You spend your time first, locating gaps and openings, and then sealing them manually with geometry. Such approaches also mean you are making modifications or additions to the CAD model that need to be tracked and removed before you hand back modified product geometry to design and manufacturing teams after you finish your analysis tasks. CFD tools typically have features or utilities to help you. Simcenter FLOEFD users will be familiar with Simcenter FLOEFD’s existing automatic fluid volume recognition strengths and tools such as “leak tracking” to identify paths between faces which is helpful in many instances.
In Simcenter FLOEFD 2512, a step change in auto-sealing for internal flow CFD tasks has been delivered to engineers in the form of enhancements to “Close Thin Slots” and “Fill Thin Slots”. This feature is accessible when you are utilizing Mesh Boolean approach to geometry handling and meshing, that is particularly suited to complex assemblies and varying quality found in CAD models. You can now retrieve the internal fluid region automatically for non-watertight models more easily, efficiently, and without altering CAD geometry.
How do you control this new automatic mesh-enabled sealing ?
Users configure “Fill Thin Slots” approach in 2 ways starting from the ribbon bar:
1) Within the mesh group, select either global mesh or local mesh and then in mesh settings you activate close “Close Thin Slots” then specify the “Maximum Heigh of Slots to Close” and other parameters.ers.
2) Within the Insert group, select Source> Fill Thin Slots which opens a dialog.
a) You then select in the graphic area faces on either side of the slot, or choose relevant bodies to consider their faces
b) Set Solid material set the desired material (or allow the default setting).
c) Set the parameter for “Maximum Heigh of Slots to Close”
d) Choose between options:
-i) Fill Thin Slots only ( A conservative approach where solid material is applied within the slot)
– ii) Fill within slots and openings (A default approach that is a more comprehensive sealing approach where solid material is applied in the slot and also extends into the fluid domain by one computational mesh cell to seal the opening fully)
Additional notes:
Simcenter FLOEFD chooses material properties from nearby to the gap to preserve close thermal model accuracy, or alternatively users can set a default value.
There is an option in the mesh viewer to view where where cells are inserted by selecting a mesh plot of “closed thin cells”.
How do you seal thin gaps in assemblies to prepare CAD geometry for CFD internal flow studies?
Find out about the new approach in Simcenter FLOEFD 2512 by watching this short video on how seal an automotive lighting CFD model for thermal analysis where there are many gaps to seal in the CAD assembly for an internal flow case. The approach uses the method starting from the “Fill Thin Slots” dialog opened from the insert group Sources>Fill Thin Slots in the ribbon. It also shows how you can view where solid material cells are added using using the mesh viewer.
Faster BCI-ROM extraction: Setting specific HTC ranges
A new way to set specific heat transfer coefficient (HTC) ranges has significantly shortened the reduced order model extraction time for BCI-ROM models. Below are results comparisons for one example model where setting suitable ranges of HTC for each boundary condition is compared to setting a single common range value. In this case, extraction is 8 times faster and memory peak usage was more than halved.
Shorter solve time for your models with thousands of two-resistor (2R) or Network Assembly components
Thermal engineers frequently leverage components modeled as two-resistors (2R) or Network Assemblies in their models. Calculations for models with hundreds or even thousands of these is now much faster through software optimization implemented in Simcenter FLOEFD 2512 release. This enables the preparation stage of analysis to take significantly less time and use less memory.
Download Simcenter FLOEFD 2512 and evaluate your own models with 2R and Network Assembly components to see what kind of speed you can get. For one example model, containing many 2R components, a comparison was carried out with the results shown below. A speed-up by a factor of 6 was realized for the solver time compared to the prior 2506 release and a significant reduction in peak memory usage achieved by a factor of more than 3 and a half.
A useful update to scripting in EDA Bridge for PCB data processing
To reduce time correcting script errors that are typically only discovered at runtime when transferring from EDA Bridge to Simcenter FLOEFD that force project restarts, scripts are now validated before running to catch errors and prevent disruption.
Model the complexity
Reduced order modeling: BCI-ROM support for 2R and Network Assembly components
Boundary Condition Independent-Reduced Order Models are reduced order models that operate in any thermal environment and are extracted from a 3D conduction-only model in Simcenter FLOEFD. It is now possible to extract these from 3D electronics thermal analysis models that contain 2R and Network Assembly components.
As a recap on BCI-ROM model formats that you can generate in Simcenter FLOEFD:
– matrices (for standalone solution)
– FMU format (for system simulation use in accordance with FMI standard)
– VHDL-AMS format (for circuit simulation electro-thermal modeling use)
Accurate radiation modeling: Henyey-Greenstein phase function
Simcenter FLOEFD has a proven history of radiation modeling for lighting applications. In the Simcenter FLOEFD 2512 release, the Henyey-Greenstein phase function has been added that enhances accuracy for modeling scattering in certain semi-transparent materials. (This is accessible via the Simcenter FLOEFD Lighting module)
You select this option and define scattering coefficients in the item properties menu.
A simple comparison using basic model and source and then changing the scattering coefficient value of a plexiglass material illustrates scattering below.
Easier sub model re-use: Rebuild of sub-projects “From component”
Many Simcenter FLOEFD users work with sub models. The previous 2506 release delivered capabilities to define project parameters in sub projects so they propagate upward into your main CFD model. Building on that release and efforts to deliver more library driven re-use of components and sub projects, in the new 2512 release there is now a built-in function to select rebuild of all sub-projects at the same time when this is required. This eliminates time overhead of manual rebuild of each sub project.
View tabular results: maximum temperature column in Component Explorer
If you are working with a complex thermal model and want to more quickly retrieve maximum temperatures of all components you can now do so in Component Explorer (as a convenient alternative to assigning many Volume Goals) . A new column provides maximum temperatures of all solids with minimal effort and does not slow down the solver. You can also export value to Microsoft Excel. You can also export a useful matching table of component names, input data and resulting maximum temperatures automatically leveraging Batch Results Processing
As a reminder, Component Explorer received significant updates in the 2412 release (LED and 2R model creation, surface power listing/summation and more) and 2506 (status and temperature column) release, so please do go back and review prior release blogs and documentation.
Updated FMU graphical editor makes connections clearer
Users are starting to leverage multiple FMU based components in their Simcenter FLOEFD projects more and more since the introduction of “FMU as a feature“. To aid the understanding of the connections to the project and to connect multiple FMU’s to each other more easily, an FMU graphical editor has been introduced. You can more easily map goals to inputs and interpret connectivity between FMUs as complexity increases.
·Explore the possibilities
Automation in Simcenter FLOEFD 2512: Added new capabilities in EFDAPI
Automation of simulation tasks continues to be a popular topic with users. EDFAPI, the API introduced back in Simcenter FLOEFD 2312 continues to be developed based on consistently received user feedback.
Key new EFDAPI capabilities added in Simcenter FLOEFD 2512:
Switch geometry recognition to Mesh Boolean
Apply default radiation surface
Switch between Global and Face coordinate systems
·Stay Integrated
For NX users performing PCB thermal analysis: PCB Exchange – EDA Bridge integration update
For customers using Xpedition and NX CAD software, there are linkages for close MCAD-ECAD collaboration enabled by PCB Exchange. As of this release, you can now author the set up of a PCB thermal simulation for Simcenter FLOEFD for NX, right from within the PCB Exchange workflow. This incorporates the ease of PCB data processing for thermal modeling purposes using EDA Bridge accessed through its integration into PCB Exchange.
Components and libraries: XTXML export of features (for 2R and Network Assembly)
XTXML export for component editing was introduced in the last 2506 release which allows users to import models from Simcenter FLOEFD Package Creator utility, make adjustments to the models and then save the models in XTXML format to libraries. Manually created detailed models can also be exported in XTXML format. The Simcenter FLOEFD 2512 enhancement now has the option to export models of 2R and Network Assembly components. This enables you to build up a component library quickly.
A note for CATIA V5 users. You can now edit XTXML files exported from Package Creator or create new XTXML library items with Simcenter FLOEFD for CATIA V5, as was introduced in version 2506 for other variants.
Avoid the risk of losing EDA files
To reduce the risk of losing EDA files from EDA Bridge for your many projects, often stored in separate folders, an option has been introduced to store EDA files nested to the main assembly. So users can choose from 3 options in settings now:
1) Model folder – files are stored next to main assembly (default option)
2) Sub-folder – files are in a separate folder next to main assembly
3) Specify – choose permanent path to the folder
Supported Architectures: x64Website Home Page : www.plm.automation.siemens.comLanguages Supported: multilanguageSystem Requirements: PC *Size: 1.2 GbEthernet network adapterMouse or other pointing device4 GB RAM minimum, more recommended1 GB of free hard disk space, more required for simulation models 购买后，将显示帖子中所有出售内容。
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